Lower coefficient of thermal expansion results in improved dimensional stability from -100°C to +250°C.
Lower coefficient of thermal expansion results in lower Phase Shift vs. Temperature.
The change in propagation time 70 - 80% less than when using solid PTFE.
Lower dissipation factor of the dielectric, lower dielectric constant, larger center conductor result in lower attenuation.
Good temperature stability allows higher operating temperature, and therefore higher power.
Low density dielectric results in lower weight.